 |
| Features |
Application |
 |
- Interface between various heat generating components and heat sinks or rails
- Isolate electrical components and power sources from heat sink
- Military, Medical devices and Industrail controls
- FPDs, Notebook PC and Mobile phones |
|
| Features |
Application |
 |
- Between IC and heat sink or chassis & power components of various packages
- Between other heat generating devices & chassis
- DRAM memory modules & Power supply
- CD / DVD ROM & HDD Cooling |
|
| SILICONE THERMAL PAD |
NK-THM-1.5W |
NK-THM-1.8W |
NK-THM-3W |
NK-THM-5W |
NK-THM-7W |
Test Method |
| Electrically & Thermal Properties |
| Dielectric Breakdown V |
Vac |
>10,000 |
>10,000 |
>6,000 |
>5,000 |
>5,000 |
ASTM D149 |
| Dielectric Constant |
1000Hz |
5.5 |
5.5 |
6.5 |
7 |
7.5 |
ASTM D150 |
| Volume Resistivity |
Ω,㎝ |
10 14 |
10 14 |
10 11 |
10 11 |
10 11 |
ASTM D257 |
| Shielding Effectiveness |
dB |
>80 |
>70 |
>40 |
>20 |
Min. 50 |
ASTM D4935 |
| Thermal Conductivity |
W/m•k |
1.5 |
1.8 |
3.0 |
5.0 |
7.0 |
ASTM D5470 |
| Physical Properties |
| Reinforcement |
|
Non Carrier or Fiberglass |
Non Carrier |
|
| Thickness |
mm |
0.2 ~ 5 |
0.5 ~ 5 |
ASTM D374 |
| Color |
|
Dark grey, light grey, grey, yellow, pink, Ivory etc. |
|
| Adhesive |
|
with adhesive or without adhesive |
|
| Specific Gravity |
g/㎤ |
2.50 (+/-0.2) |
2.70 (+/-0.2) |
2.95 (+/-0.2) |
3.10 (+/-0.2) |
3.20 (+/-0.2) |
ASTM D792 |
| Hardness |
Shore 00 |
50(±10) |
50(±10) |
60(±10) |
65(±10) |
65(±10) |
ASTM D2240 |
| Temperature Range |
℃ |
- 60 ~ + 200 |
- 60 ~ + 200 |
- 60 ~ + 200 |
- 60 ~ + 200 |
- 60 ~ + 200 |
|
| Flame Resistance |
|
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
UL94 |
|
| Inherent surface: Non tacky, one side or both sides |
|
|
Ceramic Heat Sink |
Ceramic Heat-Sink Provides Innovative Thermal Management
Benefit:
Excellent Thermal Management – Long Life, cost save, light weight |
| Product Code |
Width |
Height |
Length (mm) |
| NK212 |
22 |
1 |
22 |
| NK232 |
22 |
3 |
22 |
| NK414 |
40 |
1 |
40 |
| NK434 |
40 |
3 |
40 |
|
|
|
