 |
 |
| Structure |
|
Thermally Conductive Acrylic Adhesive |
|
Glass Fiber |
|
Thermally Conductive Acrylic Adhesive |
|
Release Liner |
|
|
| Application |
- Bonding heat sink for PCB and IC package
- Mounting of IC, GPU, heat pipe and heat sink during assembly
- Other heat transferring applications in electronic and electric appliances
|
|
| Base material |
|
Glass Fiber |
|
| Color |
|
White |
|
| Thickness |
mm |
0.100±10% |
|
| Thermally Conductive Acrylic Adhesive |
mm |
0.150±10% |
1mm/1,000mm Thickness Dial Gage/Mitutoyo 7313 |
| Total Thickness |
mm |
0.250±10% |
|
| Tensile Strength |
kg/10mm |
0.16 |
|
| Elongation |
% |
550 |
|
| Shear Adhesion |
kg/cm 2 |
3.5 |
|
| Adhesive Power(180° Peel, gf/25mm) |
|
1,000 |
PET Film (25 µm)/minSUS 304 Plate |
| Holding Power |
sec |
More than 3,600 |
PET Film (25 µm), 40℃, 500g |
| Dielectric Breakdown |
kV |
4.0 |
|
| Thermal impedance coefficient |
°C-in2/W |
0.7 |
ASTM D5470 |
| Thermal Conductivity |
W/m·K |
1.0 |
ASTM D5470 |
|
Notice
- The tape is stored in a clean and dust-free place with the temperature of 20~25°C without direct sunlight.
- Do not put anything with heavy weight above tape.
- To obtain optimum adhesion, the bonding surface must be clean, dry and well unified.
|
|
