NK Corporation Inc.

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Copper Foil with Conductive Adhesive

CPCA07 is typically used for applications requiring excellent electrical conductivity from the application substrate through the adhesive to the foil backing. Common uses include grounding and EMI shielding in equipment, components, shielded rooms, etc. The copper foil backing is solderable and resists oxidation and discoloration.

Product Code
Structure
Layer no.1	Copper	Anti Corrosion Treated avg 35µm
Layer no.2	Conductive Adhesive	Acrylic Conductive Adhesive one side avg 30µm
Layer no.3	Release paper	CP paper avg 70µm
Physical Properties
Total thickness	µm	65 ±10
Width	mm	300
Adhesive strength 180 peel 26°C*60%R.H. SUS304 Plate 30 min,300mm/min	gf/25mm	More than 800
Holding Strength (sec) PET film 25µm, 40°C, 500g		More than 3,600
Surface resitivity (0.5Kgf)	Ω/sq inch	less than 0.1
Volume resitivity (0.5Kgf)	Ω/sq inch	less than 0.1
Temperature Range	°C	- 10 ~ 80
RoHS Compliant
Lead (Pb)	ICP-AES	PASS
Cadmium (Cd)	ICP-AES	PASS
Hexavalent Chromium (Cr6)	UV-Vis	PASS
Mercury (Hg)	ICP-AES	PASS
Bromine PBBs	GC/MS	PASS
Compounds PBDEs	GC/MS	PASS